News & Events

A Novel Laser Slicing Technique for Diamond Semiconductors


Diamonds are promising materials for the semiconductor industry, but slicing them into thin wafers is challenging. In a recent study, a research team from Chiba University developed a novel laser-based technique for effortlessly slicing diamonds along the optimal crystallographic plane. Their findings will help make diamonds cost-effective semiconductors for highly efficient power conversion in electric vehicles and for high-speed communication technologies.


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